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HOME > 產業資訊 > 新聞訊息 > PCB業界動態
【10/24】TPCA Show 2018 盛大開展
日期Icon 2018-10-26
轉寄好友 (另開新視窗) 轉寄好友 友善列印 (另開新視窗) 友善列印
 

 開幕剪綵

TPCA Show 2018 隆重登場

 

展現5G生態新鏈結,落實AI應用新思維

 

19屆台灣電路板國際展覽會(TPCA Show 2018) 、第13屆國際構裝暨電路板研討會(IMPACT)1024-26日在台北南港展覽館盛大展出,1024()上午舉行隆重的聯合開幕典禮,由台灣電路板協會 吳永輝理事長與IMPACT吳志毅主席擔任主辦方代表,並邀請到工業局 呂正華局長到場致詞、隨後與國際及海內外電路板產業友會代表共17位貴賓一同出席剪綵儀式。本次展覽以PCB產業供應鏈全面升級高階材料應用及設備機台間的串連的產業熱門議題,安排AI應用及5G設備為主力展出方向,同時規劃兩大主題區:PCB智慧製造聯盟(A-team)展示區循環經濟專區專區,呈現研發成果及技術展示。與展覽同期舉行的論壇會議,今年IMAPCT聚焦IMPACT on Artificial Intelligence - Our Future」,主要將探討自動駕駛、機器人、智慧應用、無人機、人工智慧等智慧科技應用下的封裝與電路板前瞻技術探討,並規畫AI5GHeterogeneousAutomotive、內埋基板等特別論壇。另有5G板材技術與全球PCB產業發展為主題前瞻趨勢論強化PCB工業安全的工安論壇機械本質安全設計技術交流研討會PCB智慧製造論壇安排有PCB A Team廠商聯手分享推動進展、AI應用兼顧資安防護以及由產學研專家針對最新金屬化製程技術及發展趨勢提出解決之道豐富盛會隆重登場。

 

 

Grand Debut of TPCA Show 2018

 

 Demonstrate the New 5G Ecological Chain and Implement the New Thinking In AI Application

 

The 19th TPCA Show 2018 and the 13th IMPACT will be exhibited at the Taipei Nangang Exhibition on October 24-26. The grand joint opening ceremony will be held in the morning of October 24 (Wed). TPCA Chairman Rick Wu and IMPACT Chairman Chih-I Wu will be the lead representatives, and the Director-general of Industrial Development Bureau Jang-Hwa Leu is invited to attend the ceremony for a speech, who will then attended the ribbon-cutting ceremony with 17 guests from the international and domestic and overseas circuit board industry representatives. This exhibition focuses on the industry hotspots of the PCB industry supply chain comprehensive upgrade, high-end materials application and series industry among equipment machines. The AI application and 5G equipment will be mainly displayed in the exhibition, and the two major theme areas are also planned: The PCB Smart Manufacturing Alliance (A-team) exhibition area and the Circular Economy Zone will present the R&D achievements and technology demonstrations. For the forum meeting held concurrently with the exhibition, this year, IMAPCT focuses on "IMPACT on Artificial Intelligence - Our Future", which will discuss the forward-looking technologies of packaging and circuit board in smart technology applications such as autonomous driving, robotics, smart applications, drones, and artificial intelligence, meanwhile, special forums such as AI, 5G, Heterogeneous, Automotive, and embedded substrates are also planned. In addition, in the rich event, the prospective trend theory with the theme of 5G board technology and global PCB industry development, Industrial Safety Forum to strengthen PCB industrial safety, Mechanical Intrinsically Safety Design Technology Exchange Seminar will be provided. Moreover, PCB Smart Manufacturing Forum will arrange PCB A Team manufacturers to jointly promote the progress and AI application taking care of security protection. Experts from industry, colleges and R&D institutes will joint this grand event to provide the solution for the latest metallization process technology and development trends as well. 

開幕致詞者

開幕表演 

 

 
 
轉寄好友 (另開新視窗) 轉寄好友 友善列印 (另開新視窗) 友善列印
     
 
 
     
 
 
電路板新進工程師手冊 (另開新視窗)
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台灣電路板協會 Taiwan Printed Circuit Association
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