IMPACT 2017 Conference, which is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. For grasping the latest trend, the IMPACT highlights the theme “IMPACT on Intelligent Everything” toward intelligent innovations, which fall into several areas: smart application, robot, drones, autonomous vehicles, artificial intelligence, and IoT devices. Moreover, IMPACT held in conjunction with TPCA SHOW 2017 at the same period. IMPACT also organized event like TPCA & IMPACT Joint Dinner Party and IMPACT Welcome Dinner in order to appreciate everyone to attend the conference. The valuable influence toward future trends that will shape the platform of high-tech industry and academic research had been built in this grand international conference.
The conference collects numbers of papers from 18 different countries and record more than 200 speeches every year. This year, we received sponsor from ASE, ChipMO, JSR, TSMC, Atotech, Dow, Enternal, Trillian Corp., SPIL, MacDermid Enthone and TUC. We highly appreciate their support toward IMPACT 2017. For enterprises which are looking for enhancing company identity and technological strength, IMPACT welcomes for corporative sponsorship.