PCB產業蓄勢待發 第20屆台灣電路板國際展覽會(TPCA Show 2019) 、第14屆國際構裝暨電路板研討會(IMPACT研討會) 10月23日至25日在台北南港展覽館盛大展開，10月23日(三)上午舉行隆重的聯合開幕典禮，由台灣電路板協會(TPCA) 李長明理事長與IMPACT 傅勝利副主席擔任主辦方代表，同時邀請到工業局 呂正華局長到場致詞，隨後與電路板產業國際友會代表、TPCA理監事群、展覽委員會代表們共33位貴賓一同出席剪綵儀式。由本次展覽以「5G Next」為主軸，展品展示PCB產業與5G發展鏈結的高度關係。PCB產業首先受惠於5G基地台建置，後將擴大到伺服器、手持裝置、智慧運輸、智慧工廠等更廣泛的應用。5G高頻高速材料及相關材料、設備將成為今年TPCA Show的主力展出方向，三天展場內皆有舉辦展商新產品發表會，帶來5G相關的產品材料、技術趨勢。今年IMPACT研討會由IEEE EPS-Taipei、iMAPS-Taiwan、ITRI及TPCA 聯合舉辦，以「IMPACT-IAAC on 5G-Evolution& Revolution」為主題，主要將探討5G世代來臨下材料製程應用下的封裝與電路板前瞻技術探討。論壇會議活動由TPCA李理事長以PCB產業高峰會於開幕首日揭開序幕，包含有智慧製造論壇-分享PCB邁入工業3.5落地之道、PCB安全標準驗證起始說明會暨安全講座以及針對最新金屬化製程技術及發展趨勢提出解決之道。豐富多元的活動，為一年一度不可錯過的盛會。

Grand Opening of TPCA Show 2019

2019 - the year of 5G, PCB industry is ready to take off

　　The 20th TPCA Show 2019 and the 14th IMPACT-IAAC will be held at the Taipei Nangang Exhibition on October 23rd to 25th. The grand joint opening ceremony which organized by TPCA Chairman Maurice Lee, and the IMPACT Vice Chairman Sheng-Li Fu is on October 23^rd (Wed.) morning, and the Director General of Industrial Development Bureau, Mr. Zheng-Hua Lu is invited to attend the ceremony for a speech, who will then attended the ribbon-cutting ceremony with 33 guests from the international circuit board industry representatives, the board of directors and supervisors and Exhibition Committee of TPCA. The main theme of the exhibition this year is "5G Next", to demonstrate the highly connection between the PCB industry and the 5G development chain.  The PCB industry will be the first to be benefited from the establishment of 5G cells, and then to a wider range of applications such as servers, handheld devices, smart transportation, and smart factories.  Therefore, the 5G high-frequency and high-speed materials and the materials and equipment in related will be the main exhibitions of the TPCA Show this year. The exhibitor's new product launch presentation will be held in the exhibition hall in these 3 days to present 5G product materials and technology trends. This year's IMPACT seminar is jointly organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, with the theme "IMPACT-IAAC on 5G-Evolution& Revolution" will discuss the Prospecting Technology and Material Application of Packaging and Circuit Board in 5G era. The seminar will be kicked off by TPCA Chairman Mr. Lee with PCB Industry Summit on the first day, including smart manufacturing seminar-PCBECI applications & advanced FPC Smart manufacturing alliance wrap-up, PCB safety seminar, IPC high reliability technic conference and solutions to the latest metallization process technology and development trends. This is going to be a diverse and must-attend event of the year.