The TPCA Show 2022 and 17th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) is held from October 26-28 on the 4th floor in Hall 1 of the Taipei Nangang Exhibition Center. Nearly 450 domestic and foreign brands of the electronic industry chain are invited. Since the border has been reopened recently, it is estimated to attract more than 35,000 professionals and buyers from Japan, Korea, Thailand, Japanese, Korean, Thailand, Vietnam and U.S. buyers than before will come to visit the Nangang Exhibition Center.
      Mr. Maurice Lee, Chairman of TPCA, Mr. Richard Lee, Chairman of TEEMA and Ms. Yi-Ling Chen, the Chief Secretary of MOEA gave a speech in the opening ceremony, while guests such as Dr. Shen-Li Fu, Co-Chair of IMPACT and WECC representative took part in the ribbon cutting ceremony. The representatives from Southeast PCB Asian countries will also take part in this event to kick off the biggest PCB exhibition this year. In the same period, EMA TAIWAN 2022 is held by TPCA, TEEMA and TAITRA to present the comprehensive electronic manufacturing trend and promote technical R&D, while showing solidarity in Taiwan’s electronic industry, in the hope that it will become the most iconic electronic exhibition in the world.
      Aligned with the expectations that Taiwan’s PCB industry can achieve high-end manufacturing and net-zero emissions, the TPCA Show 2022 has built the theme zones “IC Substrate/PCBs” and “Sustainability” to optimize carbon reduction and introduced ESG to present the vision of high-end manufacturing processes and smart manufacturing.
      The TPCA Show has promoted low-carbon exhibition for 13 years and introduced more than 67 practices, to act in concert with the three themes “Environment,” “Social” and “Governance” 82 ％ of the exhibitors voluntarily announced that their booths will be designed in a sustainable way with ecofriendly decorations.
      IMPACT has renowned exhibitors this year and is held jointly by IEEE EPS-Taipei, iMAPSTaiwan, ITRI and TPCA. It’s theme “IMPACT on Empowered Edge Computing” discusses the advanced packaging and PCB technologies in the applications of 5G, AI and HPC. In addition to the famous companies, such as the SPIL, Nanya Plastics, ASE, Atotech, Intel, and TRIALLIAN which sponsored technical session. What’s more, the IEEE EPS Panel is held for the second time with the cross disciplinary packaging experts from Intel, kneron, and Winbond who will discuss with attendees via hybrid way.