歡慶二十年創新里程碑 — 邀請您共襄盛舉 IMPACT 2025！
摘要投稿截止日期：2025年6月20日      錄取論文將收錄於 IEEE Xplore！
Celebrate 20 years of pioneering innovation— join us at IMPACT 2025!
Submit your abstract before June 20 2025     Accepted Papers Will Be included in IEEE Xplore !

 

     自2006年創辦以來，IMPACT構裝暨電路板國際研討會始終走在技術革新的最前線，致力於推動先進封裝、印刷電路板（PCB）及半導體產業的發展。過去二十年來，IMPACT見證且積極參與5G、人工智慧（AI）、高效能運算（HPC）、邊緣運算與永續發展等領域的快速進步。

     每年，IMPACT會議皆緊扣產業最新趨勢，持續推動前瞻技術與產業應用的深度對話。今年隆重邁入第20屆，IMPACT 2025將以「節能高效AI：從雲端到邊緣」為主題，呼應產業對高效能、低功耗解決方案日益殷切的需求。隨著AI應用從大型資料中心延伸至邊緣裝置，先進PCB、IC載板、異質整合與封裝技術的重要性也與日俱增。

     今年不僅是對過去二十年的致敬，更是邁向未來的嶄新起點。IMPACT將持續引領、啟發並驅動創新動能。誠摯邀請您參與IMPACT 2025，攜手開創AI、半導體封裝與PCB技術的新世代，共築更智慧、更永續的世界。

     Since its inception in 2006, the IMPACT Conference has been at the forefront of technological evolution, fostering innovation in the packaging, PCB, and semiconductor industries. Over the past two decades, IMPACT has not only witnessed but actively contributed to rapid advancements in 5G, AI, high-performance computing (HPC), edge computing, and sustainability.
     Each year, the conference has adapted to the latest trends, driving forward the conversation on emerging technologies and their industrial applications. Now in its 20th year, IMPACT 2025 embraces the theme “Energy-Efficient AI: From Cloud to the Edge,” reflecting the industry’s growing emphasis on high-performance, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.
     This milestone year marks not just a celebration of the past 20 years, but a bold step into the future, where IMPACT continues to lead, inspire, and drive innovation. Join us at IMPACT 2025 as we shape the next era of AI, semiconductor packaging, and PCB technology—powering a smarter, more sustainable world.

【Date】Oct. 21st (Tue.)-24th (Fri), 2025
【Venue】Taipei Nangang Exhibition Center
【Theme】Energy efficient AI: From Cloud to the Edge
【Organizer】IEEE-EPS、iMAPS Taiwan、ITRI、TPCA
【Feature】Plenary speech、Industrial session、Special session、Invited talks、PDC
【Exhibition】TPCA Show, TAITRONICS, AIoT Taiwan
【On-line Submission】www.impact.org.tw
【IMPORTANT DATE】 

【SCOPE OF PAPER SOLICITED】

* Papers relevant to the above scopes are encouraged to submit but NOT limited to.

* Conference organizer keeps the right to finalize session arrangement.

* Authors of accepted papers including oral presentations and posters should register before the deadline; please be noted that unregistered (paid) papers will be removed from the conference program.

* The organizer reserves the right to modify the agenda.

PAPER AWARD

Outstanding Paper Award will be elected by IMPACT Technical Program Committee from student and industrial papers respectively. The paper awardees will be announced and honored next year.

Evaluation criteria： Originality, Completeness, Significance, Industrial merit of the abstract, full paper, and presentation.

 

【20 Years of Evolution and Excellence】
2006 The 1st IMPACT
2007 Packaging and PCB Taiwan
2008 Creative Collaboration, More Than Packaging
2009 IMPACT Your Future: Integration, Efficiency, & the Eco-friendly
2010 Embrace IMPACT, Create Possibilities
2011 IMPACT- Leading Innovation
2012 IMPACT, Inspiring Innovation
2013 Green & Cloud: Creating Value and Toward Eco-Life
2014 Challenges of Change - Shaping the Future
2015 IMPACT on Mobile and Flexible Electronics
2016 IMPACT on the Next Big Things
2017 IMPACT on Intelligence Everything
2018 IMPACT on Artificial Intelligence-Our Future
2019 IMPACT on 5G - Evolution & Revolution
2020 HPC (High Performance Computing)
2021 IMPACT on 5G+
2022 IMPACT 2022 on Empowered Edge Computing
2023 IMPACT on the future of HPC, AI and Metaverse
2024 IMPACT on Sustainable Technology
2025 Energy efficient AI: From Cloud to the Edge