代碼

領域

B1

Sustainable Materials and Manufacturing Technology

Green materials (lead-free, halogen-free, PFAS free, energy saving, recycling, reusing, reducing etc.), Low carbon emission process and manufacturing.

B2

Smart Manufacturing, Inspection and Testing

Modeling and simulation techniques, Intelligent control and manufacturing, Automatic control system and Process integration. Feature testing and verification, Inspection (AOI, non-destructive testing etc.), Signal and power integrity measurement and evaluation, Failure mechanism analysis.

B3

HDI PCB, IC Substrate and FPC Technology

SAP and m-SAP process, Build-up board, Micro-vias and copper deposition and plating process, Multilayer core and coreless, Advanced flex, Chip on flex and Rigid-flex.

B4

Advanced and Emerging Technology

High speed transmission technology and materials for AI and sever applications, High frequency circuitry technology and materials for mini-wave applications, High power and thermal dissipation, Embedded devices, Photo and non-photo dielectric for high density circuits and advanced package substrate materials and process.

P1

Advanced Packaging Technologies

Packaging configuration :

AI/HPC-driven advanced packaging architectures,Wafer-level packaging, Panel-level packaging, Flip chip packaging, Chip scale packaging, Fan-in/fan-out technologies, Multi-chip modules, High performance computing package, Fine pitch/high pin packaging solution, Co-Packaged Optics.

Heterogeneous integration:

High performance computing heterogeneous integration (side-by-side integration, vertical stacking integration, chiplet, high bandwidth memory), Mobile heterogeneous integration (SiP, PoP, PiP etc.)

nD architectures :

Si/Glass /Organic interposer, Si bridge, Glass substrate, Advanced substrate, 3DIC, Hybrid bonding, TSV, TGV, Wafer bonding, and Other new technologies for advanced microelectronics.

MEMS:

Microsystem packaging, New MST-enabled possibilities, New sensing and actuation mechanisms Multi-physics simulation of microsystems, New materials and processes for MST, Testing and calibration of microsystems, and Sensing, actuation and control circuits on microsystems.

P2

Power Electronics Packaging

Si/GaN/SiC/ Ga2O3 based power device and module (IGBT, MOSFET, HEMT, diode, IPM etc.), Power electronic module systems (inverter, converter, rectifier etc.);

Fabrication and assembly, Low-temperature bonding, Sintered Ag/Au bonding, Solid-Liquid Interdiffusion (SLID) bonding, Interconnection (wire-bonding, Cu clip bonding, chip embedded PCB etc.), Encapsulant material, Advanced cooling system, Ceramic substrate technologies (DBC, IMS, DPC, AMB etc.), High-performance passive components (super capacitor, inductor etc.), and Other related technologies.

P3

Interconnections & Nanotechnology

Interconnect technologies on all packaging levels (wire bonding, flip chip and TSV connections, first-level package etc.), Special emphasis on design and process of solder alternatives (ICP, ACP, ACF, NCP etc.), Under bump metallurgy, Electromigration, Micro-bump, Substrate technology, Novel enabling techniques, Electrical performance, and Environmental concerns.

P4

Design, Modeling, AI/Machine Learning Applications, and Testing

Design for reliability :

Electrical, optical, thermal and mechanical modeling & design; Component-, board- and system-level reliability, Interfacial adhesion strength, Advanced testing and measurement techniques, Advances in reliability test methods and failure analysis.

Digital Twins :

Design of experiment, Design optimization, AI/machine learning applications, Design-on-Simulation technologies and tools, Design rule development, Virtual prototyping in product and/ or process design. AI/ML-driven design automation, Data-driven defect analytics.

Chiplet System design :

From micro to macro simulation, Multi-physics simulation, and Thermal management (materials, heat sink, heat pipe, fan, thermal interface material, package-, board- and system level thermal design, measurement technology, two-phase heat transfer, air cooling/liquid cooling, immersion cooling, emerging cooling technology, thermoelectric cooling & generation etc.).

P5

Advanced Materials, Automatic Process & Assembly

Materials and automatic processes for 2D/3D microelectronics, Sustainable and low-carbon materials, Smart manufacturing with in-situ monitoring, and MEMS, sensor and microsystem packaging, including adhesives, encapsulates, lead free solders and alloys, thermal interface materials, high/low-k dielectrics and substrates, thin films, TSV drilling/etching, plating, low temperature bonding, assembly processes, and equipment for automation.

P6

Emerging Systems Packaging Technologies

Embedded passives & actives on substrates, Packaging solutions for RF-microwave, bioelectronics, automotive electronics, photonics, micro-LED, and medical electronics, Wearable/flexible technologies and Other novel system packaging technologies.

P7

Sustainable Technologies & Systems

Green and sustainable electronics, Net zero strategy/technology, Green packaging, Renewable energy, Energy storage, Sustainable substrate and PCB manufacturing, Energy-efficient system-level design for AI and data centers.