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想串聯終端產業嗎??即刻加入iNEMI工作組

2020/09/11

技術整合小組 (TIGs)

 

 

 

TIG Updates — iNEMI members —如果您想要參加iNEMI技術整合小組, 並想要參與計畫, 您可查閱以下最新電路板&基板及永續電子等相關資訊:
 

  • PCB & Laminates —  Several potential project areas are being considered, including mitigation of 5G signal loss due to PCB copper foil surface treatments, reliability testing of hybrid PCBs for high frequency applications, and mitigation of field failures due to pad cratering. For additional details, please contact Steve Payne (steve.payne@inemi.org).
  • Sustainable Electronics — Investigating two new potential projects with a focus on the realization of a circular electronics economy. Extended Reliability Assessment for Electronic Components and Eco-Design Leadership Best Practices for Sustainable Electronics were both presented at the recent iNEMI virtual workshop at EGG 2020, and there will be a follow-up webinar on September 30 (open to members and non-members) to further define the scope of each project. Please contact Mark Schaffer (marks@inemi.org) for project and/or meeting information.

 

Call for Participation

Sign Up Now for New Projects — Several new projects and initiatives are still accepting additional participants. This is a great opportunity to get involved early and help define the project direction. Please contact infohelp@inemi.org or the contacts listed for the projects. 

In development 

New projects still accepting participants