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TOPFlex Corporation
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Tel
+86-512-57657768
Fax
+86-512-57657786
Address
No.2518,Chengbei West Road,Bacheng Town,Kunshan City,Jiangsu Province
Company Profile
松揚電子材料(昆山)有限公司成立于2005年9月，公司註冊地址:昆山市巴城鎮城北西路2518號。總投資3568萬美元，註冊資本為1700萬美元，由中國台灣新揚科技股份有限公司獨資經營方式，2006年11月完成大陸昆山擴廠的計畫。松揚電子總部是台灣新揚科技股份有限公司，是一家專業生產銷售電子材料的軟性銅箔基板公司，致力于電力材料領域，為用戶提供最優的產品和最佳的服務。新揚科技在軟性銅箔基板行業中處於領先地位，目前產能居世界前五位，公司從材料研發到設備研發，提供給客戶材料、包裝設備和測試設備的整體解決方案。產品被客戶長期出口到日本、新加坡、美國等世界各地，帶動包括電子計算機、微電子行業等整個IT行業的高速發展。
公司2020年銷售額達4.36億。公司主要產品包括無膠式軟性銅箔基板(含有5G高頻材料)、有膠式軟性銅箔基板、覆蓋膜、補強板、複合膜，其主要應用式工業的醫療儀器、航天、軍事用途、液晶顯示面板、軟硬複合板、筆記本、智能手機、智能平板、車載等軟板用途。
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