Empowering the Next Generation of Tech Leaders With a mission to boost global industry competitiveness, bridge the gap between academia and corporate needs, and cultivate top-tier talent for the future, TPCA actively launches diverse industry-academia initiatives. By connecting top universities and institutes across Taiwan, Mainland China, and Thailand, we create a powerful ecosystem that drives innovation and sustainable talent growth worldwide.
Industry-Academia Collaboration Item：
Credit courses：Level up your expertise! Master high-demand skills in advanced packaging and PCB tech through hands-on, industry-certified courses.
Scholarship for research (grad student)：Fuel your research journey! Get the financial backing you need to focus on what matters—leading the next wave of tech innovation.
PCB & Packaging Elite Student Paper Award：Showcase your genius! Present your groundbreaking research, gain industry recognition, and win awards as a top tech talent. Academia Partners：
University form Taiwan： NCU、CYCU、YZU、NTUT、NTU、NTUST、NCKU、CGU、LHU、NYCU...... University form China： SYSU、DGUT、HLJU、SUDA、SUST......
University form Thailand： BDI、BU、CMU KKU、KMUTNB、KMUTT、KU、MU、MUT、PSU、SBAC、STCS、SSRU、SUT、UBRU、UBU......