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Linco Technology, Co.,Ltd.

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Tel +886-4-24608771
Fax +886-4-24608779
Address No.16, Keyuan 1st Rd., Xitun Dist., Taichung City 407731 , Taiwan (R.O.C.)
Company Profile LINCOTEC, which was founded in 1999, has professional technical teams from a variety of fields, including semiconductor equipment, IC packaging, and optoelectronic technology, with a focus on core technologies (thin film process, plasma technology, AI, automation), process equipment, and heat dissipation modules development. Advanced semiconductor packing, advanced semiconductor carrier materials, next-generation displays, advanced heat dissipation substrates, green energy technology applications, and compound semiconductors are all included in the market layout.
In 2010, LINCOTEC pioneered conformal shielding sputtering equipment for the key process of SiP system packaging, which is used in B5G smartphones, wearable devices (Watch, TWS headset, AR/VR wearable devices), Internet of Things (IoT), and Internet of Vehicles (V2X), among other industries.

LINCOTEC expanded foundry business investment in 2021, focusing on product development of semiconductor materials applied to heat-dissipating substrates, developing thin-film heat-dissipating substrate manufacturing processes with semiconductor process technology, and replacing existing domestic wet processes with dry environmental protection processes to drive domestic industrial technology upgrades and development in response to government directives. The company's goal of "zero emission of green energy and reduction of secondary pollution" is realized through the "2050 Net Zero Carbon Emissions" policy.
LINCOTEC, founded in 1999, specializes in thin-film sputtering (PVD) and plasma etching equipment, with over two decades of expertise in advanced thin-film RDL and dry process technologies.

LINCOTEC is a leading provider of SiP EMI shielding sputtering equipment and a key contributor to the global SiP supply chain for major mobile device manufacturers. Its solutions are widely adopted in applications such as 5G smartphones, wearable devices, IoT, V2X, and LEO satellite communications.

In response to advance packaging demands, LINCOTEC has expanded its technology portfolio to Fan-Out Panel Level Packaging (FOPLP) and IC substrate applications, enabling high-density panel-level RDL and fine-line dry etching processes to support high-performance, high-reliability, and scalable manufacturing in the moving towards fine line interconnection technologies.
Website http://www.lincotech.com.tw/tw/index.php
Sales Contact Bill Chen
Sales Contact Email bill.chen@lincotec.com