Shen Rong-jin, Vice Premier of Executive Yuan, said that the number of electric vehicles will officially surpass that of fuel vehicles by 2037, and Taiwan should make use of the open platform to develop electric vehicle (EV) brands and create its own ecosystem for the EV industry. According to analyses by research institutions, business opportunities in the EV charger field worldwide are estimated to be as high as US$500 billion (about NT$14 trillion). The EV charger industry can be classified into software and hardware fields, and Taiwanese manufacturers, from local major players to start-ups, have shown a lot of ambition to grasp a share of such business opportunities.

        With the trends of global net-zero emissions and the electrification of transportation, EV has become one of the necessary, strategic pathways for automakers to respond to future international standards. Driven by a strong force and post-epidemic stimulus plans for the market from various countries, the EV market around the world was not really affected in 2020, and sales exceeded around 5 million, with the likelihood of surpassing the 6 million mark in 2021. Furthermore, it is estimated that shipments related to the EV industry worldwide in 2030 will reach 23.6 million, and output value reaching as much as US$196.9 billion.

        With the gradual popularization of EVs, the charging facility market has also been propelled into growth stage, with an estimated annual growth rate of 15-20% extending from 2021 to 2025. The 22~50kW DC EV charger market currently remains in mainstream demand, but 50~200kW products, with an increasing penetration rate by pure EV, are likely to occupy an increased market share of 21.3% by 2025.
        The surge of high-power EV chargers indicate that PCB products will have the capacity to load greater high-power components (frequency conversion, rectification, voltage transformation, signal processing, and control). Aside from highlighting the development potential of more efficient heat dissipation materials, this change should also render the original thick copper plate, previously unique to the field of special PCBs, to have an increasingly important place in the drive of EV applications. Products such as HLC or HDI can then be designed larger and with more layers and more substantial thickness to increase the copper content of PCB and improve heat dissipation efficiency. Conversely, it should also create difficulties with drilling, electroplating, and wiring.