News Briefing Apple has recently released a new generation of MacBook Pro at its product launch conference., All products ranging from the 12.9-inch iPad Pro to the MacBook Pro will be equipped with a new Mini LED backlights display technology. As indicated from the study by the research institute, TrendForce, it is estimated that shipments of notebooks equipped with Mini LED backlights, along with the new generation of MacBook Pro rushing into high-end markets, will reach 5 million units in 2022; an annual growth rate of 213%. Impact Analysis Mini LED backlights are considered to be display technology between traditional LED and new generations of Micro LED. However, the characteristics of Mini LED backlights are on par with OLED or even better. Although manufactures of OLED have persistently worked to improve features like brightness, life span, and cost reduction for larger sizes, it is expected that Mini LED backlights are likely to have gained a large advantage in medium and large-sized high-end products due to factors like increased participation manufacturers, rapid cost decline, and various others. Taiwanese manufacturers have played a key role in Mini LED production and its supply chains around the world. This includes die manufacturing/sorting, packaging, printing, backplanes, backlight modules, driver ICs, and panels. Right now, there are three respective solutions for backplanes, namely, PCB, FPC, and Glass (glass substrate). Large-sized (such as TVs) or medium-sized (such as tablets, computer screens, car monitors, etc.) displays have backplanes that have mostly adopted PCB because of the large area and pixel pitch. On the other hand, small-size displays (such as smart mobile phones, smartwatches, etc.) adopt FPC and Glass as the mainstream because the smaller size necessitates a fine circuit design. In the future, the circuit design of backplanes will be done below 30μm for AR/VR products and other displays used in Metaverse, and Si CMOS made through a semiconductor process will likely be switched to primary utility. For small and medium-sized Mini LED products, line spacing design has increasingly become dense dues to the large number of LEDs used per unit area. To improve the yield rate of printing parts, requirements for the uniformity of the pad and size of the solder-mask window should become much more stringent. Besides this, since most of them are thin-plate designs, it is a matter of course that this will greatly increase production difficulty as they consist of high-end PCB products. As such, substrate manufacturers would need to have outstanding process capabilities in terms of electroplating, wiring, solder-mask, and thin-plate transfer.