News Briefing

MIC, as a partner factory of equipment for TSMC, has actively responded to the development of hydrogen energy. As its initial target, it is to focus on the residual hydrogen generated by EUV machines in the wafer manufacturing process. After purification, the gas can be further recycled and reused. MIC is currently working with the Asia Hydrogen Energy and Industrial Technology Research Institute (ITRI).

Impact Analysis
Finding ways in which sufficient renewable energy can be generated or used has become the immediate focus after many countries and companies have declared their goal of carbon neutrality by 2050. Aside from the existing solar energy, wind energy, hydropower, or even nuclear energy, as it has been argued of late whether or not these can indeed be classified as green energy. All of these choices of energy have, as a whole, proved that it is most difficult for existing energy solutions to achieve zero carbon emissions, resulting in the development of new energy sources almost becoming a consistent action by countries around the world.


 

From the perspective of energy policies by global organizations and major countries, hydrogen energy has seemingly become a rising star for the future because its feature of outstanding compressibility makes it most suitable for storage and mobility. As an energy storage system, hydrogen is likely to become a stable power supply for enterprises, helping to make up for the defects of unstable power supply rendered by the seasonality of solar photovoltaic and wind power. Taiwan’s hydrogen energy project has already been included in the blueprint for 2050 net-zero carbon emissions. It is planned for 9 to 12% of the energy to be generated from hydrogen by 2050. ITRI also released the "Hydrogen Application Development Technology Blueprint of Taiwan in 2050" at the end of June. In addition, several countries with a high correlation to PCB have also charted out specific plans, which can be used as a reference guide to manufacturers for evaluation and planning.