News Briefing Glass substrates are regarded as the next technological trend in the industry. Intel and Samsung are actively setting up production lines, aiming for large-scale production in the coming years. Meanwhile, AMD plans to develop and launch related chip technology in 2025 to seize a market advantage. Impact analysis Glass substrates (Glass Substrate) or glass core technology (Glass Core Technology) are considered key materials for the next generation of advanced semiconductor packaging technologies. Compared to current mainstream packaging substrates, glass substrates offer advantages such as ultra-low flatness and thermal stability, allowing for the integration of more transistors into a single package. This can achieve higher density and greater performance in the AI era. Major global semiconductor companies, including Intel, Samsung, SK Hynix, and AMD, have announced plans to introduce solutions using glass substrates. Samsung has tasked its subsidiary, Samsung Electro-Mechanics, with initiating research on glass substrates and is leveraging resources from its display division to ensure production capacity. A pilot production line is expected to begin testing as early as September 2024. SK Hynix is investing $300 million through its U.S. subsidiary, Absolics, to develop dedicated production facilities in Georgia, with mass production anticipated to start in early 2025. AMD will integrate various glass substrate suppliers on the market and conduct evaluation tests on different glass substrate samples, aiming to begin chip production using glass substrates between 2025 and 2026. Glass substrates are particularly suitable for large substrate demands of sizes 110mm x 110mm and above. This is because large substrates often carry higher transistor densities and are more susceptible to thermal shock, making the low thermal expansion coefficient of glass substrates advantageous. In the future, the applications of glass substrates will include AI server CPUs and GPUs, switch IC chips, and RF modules. However, because glass is prone to breakage, it is not suitable for high-risk products that are exposed to physical impacts, such as laptops and automotive devices. According to research by Fuji Economic Research Institute, glass substrates are expected to begin mass production in 2026, with initial shipments of 2,000 square meters, and further expand to 8,000 square meters by 2027.