The TPCA Show 2024 and the IMPACT 2024 were held from October 23 to 25 at the Taipei Nangang Exhibition Center, Hall 1, on the 1st and 4th floors. This year marked the 25th anniversary of the TPCA Show, setting a new record for exhibition scale. The exhibition area expanded by 30% compared to last year, featuring over 1,600 booths and attracting participation from 610 top global brands, with over 40,000 international professional buyers gathering under one roof.

This year’s highlight theme, "Innovative AI in PCB," covered critical technology fields such as AI, 5G, high-speed computing, substrate technology, servers, base stations, net-zero carbon emissions, and electric vehicles, reflecting the latest technological trends and market dynamics in the electronics industry. Additionally, the concurrent IMPACT Conference centered on “IMPACT on Sustainable Technology” to explore advancements in sustainable development, cutting-edge packaging technologies, PCB manufacturing processes, and forums focused on achieving net-zero emissions in the PCB sector and global substrate carbon reduction innovations.　

Four Major Exhibitions Showcase the Full Strength of Taiwan’s Electronics Industry Chain

The TPCA Show 2024 once again joined forces with the TAITRONICS 2024, the AIoT Taiwan, and the OPTO Taiwan to create the Taiwan International Electronics Manufacturing Joint Exhibition. This collaboration brings together the entire electronics manufacturing ecosystem, spanning electronic components, photonics, lasers, circuit boards, connectors, system integration, and IoT solutions, showcasing the full capacity of Taiwan’s electronics manufacturing industry.

In line with its commitment to net-zero sustainability, the TPCA Show encouraged attendees to use public transportation during the event, offering a chance to receive exclusive commemorative gifts celebrating the 25th anniversary in collaboration with Guai Guai Snack.

PCB Industry Expands into Thailand: TPCA Show Establishes Thailand Pavilion to Support Growth

Driven by geopolitical factors and customer demand, the PCB industry has seen a strong wave of southward investment since late 2020, with Thailand emerging as a primary destination. Thailand now hosts a significant PCB industry chain, with new production capacities from major companies set to come online by the end of 2024. This expansion is anticipated to boost Thailand’s PCB output and increase its global market share from 3% in 2020 to nearly 5% by 2025.

To support the industry’s southward expansion, TPCA has established the Thailand sodality and organized a dedicated Thailand show area at this year’s exhibition. Within this area, the Thailand Technology Talent Development Program was launched, inviting over 40 students from Thai universities to Taiwan for visits and the signing of a Taiwan-Thailand industry-academia cooperation MOU. This initiative aims to foster expanded industry-academia partnerships and matching projects, with specialized technology training in Thailand set to begin in November. By the end of next year, the goal is to train 180 skilled engineers to join TPCA member companies. Additionally, a Thailand Investment Briefing was held on October 23, featuring insights from a Thai law firm on Thai investment regulations, setup procedures, and practical advice based on real-world experiences.

IMPACT 2024 Gathers Industry Leaders from TSMC, NTT, SK Hynix, and NXP Semiconductors

The concurrent 19th IMPACT conference was co-hosted by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, focusing on the theme “IMPACT on Sustainable Technology.” This year’s conference centered on advancements in packaging and circuit board technologies and explored strategic trends in the integration of technology and resource sustainability. Featuring 34 forums and over 250 presentations—all delivered in English—IMPACT is the largest and one of the most renowned international conferences on packaging and circuit boards in Asia and worldwide.

This three-and-a-half-day international conference opened with a grand ceremony on the morning of the first day, held for the first time at the 7th floor of the Taipei Nangang Exhibition Center Hall 2. The ceremony included the presentation of outstanding paper awards and acknowledgments for sponsors, followed by a series of high-profile keynote speeches. Japan’s telecom giant NTT made its Taiwan debut, unveiling IOWN’s fully optical network. TSMC presented the AI and high-performance computing-driven boom in CPO packaging. On the second day, South Korea’s memory leader SK Hynix shared insights on HBM4 technology for increased performance, low power, and high efficiency, while NXP Semiconductors discussed how edge computing and heterogeneous integration are enabling applications for the AI era.

ASE, Intel, MKS Atotech, AMD, DuPont, and SPIL Lead Forward-Looking Technology Forums

This year, IMPACT continued to set the stage for forward-looking technology topics, hosting specialized forums featuring renowned companies such as Intel, Atotech, AMD, DuPont, and SPIL. For the fourth consecutive year, the IEEE-EPS Special Forum, chaired by ASE's Vice President CP Hung, invited advanced industry leaders including NXP, MediaTek, and IMAPS, as well as IEEE-EPS HIR Chair Dr. Bill Chen, to discuss breakthroughs in heterogeneous integration advanced packaging technologies and future blueprints—not to be missed!

To cultivate the next generation of industry talent, IMPACT 2024 also launched the Professional Development Course (PDC) for the first time. The course featured industry expert Dr. John Lau, offering a three-hour session on small chip technology, heterogeneous integration, and CPO, while Dr. Li Ning-Cheng presented a course on high-reliability soldering in semiconductor packaging.

IMPACT 2024 is set to host an impressive eight special forums covering market trends, glass substrates, heterogeneous integration, 3D embedded substrates, and international collaborations with partners such as ICEP, JIEP, ISMP, and SMTA. Hundreds of top-tier international academic and industry experts from Europe, the U.S., Japan, and South Korea will present in Taiwan, making it the most significant international conference on packaging and circuit boards this year, once again focusing industry attention on Taiwan.

Taiwan’s PCB Industry Perseveres in Low-Carbon Transition, Substrate Innovations Drive Carbon Reduction

In 2023, TPCA unveiled Taiwan's PCB low-carbon transition strategy, setting ambitious net-zero targets: a 30% carbon reduction by 2030 and net-zero emissions by 2050, based on 2020 levels. Observational research, reinitiated this year, highlights that Taiwan's PCB industry is proactively advancing carbon accounting and self-directed carbon reduction, progressing ahead of its initial timeline. However, the industry still requires diverse low-carbon and renewable energy sources to lower Taiwan's energy intensity, addressing the high energy demands posed by ongoing expansions in advanced PCB and substrate manufacturing processes to meet long-term net-zero goals.

Supported by the Industrial Development Bureau’s Electronics and Information Division, this year’s exhibition will host the PCB Low-Carbon Advanced Forum, while the Department of Industrial Technology will oversee the Global Substrate Carbon Reduction Innovation Forum. These forums will bring to light Taiwan’s PCB and substrate industry's urgent call for low-carbon transformation and its concrete actions towards a sustainable future.

For More Information, Please Visit:

TPCA Show 2024 Official Website: http://tw.tpcashow.com/

IMPACT 2024 Official Website:  http://www.impact.org.tw

Pre-Registration for Visitors: