As chip technologies continue to advance, advanced packaging and IC substrates have become essential drivers of semiconductor industry development. With decades of expertise in PCB manufacturing processes, quality management, and microsection failure analysis, Frank Bai has compiled his extensive research insights and technical knowledge into 《Advanced Packaging and Carrier/Main PCB》. This book helps readers build a comprehensive understanding of the technologies connecting advanced packaging, IC substrates, and PCBs.

At the Book Launch and Signing Event, Frank Bai will personally share the inspiration behind the book, its key technical insights, and his observations on the industry. He will also guide participants through the latest trends in advanced packaging and IC substrate technologies.

The event will feature a book-signing session and opportunities for attendees to meet and exchange ideas with the author while receiving a personalized keepsake. We warmly invite industry professionals, engineers, and technology enthusiasts from the PCB, semiconductor, and electronics manufacturing sectors to join this exciting occasion celebrating professional knowledge, industry expertise, and the passing of technical wisdom to future generations.