2021/01/20
  Globally, Taiwan, Japan and South Korea dominate the market share in terms of the manufacture and distribution of carrier boards. Taiwanese manufacturers account for 40% of the market, making it, at present, the region with the highest share of carrier board production. Currently, South Korea and Japan have an equal share in the rest of the carrier board manufacturing market. Of these two competitors, Korean manufacturers have, it is significant to note, been growing rapidly. This growth, in particular, has been due to the shipment of SEMCO carrier boards produced for Samsung mobile phones.

     In terms of future business opportunities and growth in the market, 5G construction that began in the second half of 2018 has already created additional demands for ABF substrates. After manufacturers expanded their production capacity in 2019, the market is still in short supply. Taiwanese manufacturers have invested more than NT$10 billion to develop plants for greater production capacity. The demand for ABF substrate will also be generated by the supply of equipment for base stations, communication equipment, high-performance computers, and so forth. As follows, it is suggested that, due to the high demand in the market, 2021 will continue to be a year in which ABF substrate will remain in short supply. On the other hand, it is important to consider that 5G smartphones have started to adopt AiP to improve the signal reception capability of mobile phones (Qualcomm launched an AiP module in the third quarter of 2018).
     While previous 4G smartphones made use of flexible printed circuits (FPC) as antennas, an AiP module uses a short antenna, RF chips, etc. These are packaged into a module, which has also created a demand for AiP. Also, 5G terminal communication equipment utilizes 10 to 15 AiPs, while each AiP antenna array is designed with 4x4 or 8x4, creating a greater demand for enhanced carrier boards.

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