國際構裝與電路板研討會  發表全球最新智慧化趨勢

全台最盛大的國際電子零組件、組裝、封測、電路板產業的年度盛會-第12屆國際構裝暨電路板研討會(簡稱IMPACT)，已於10月25日台北南港展覽館盛大展開，今年研討會主題聚焦在「IMPACT on Intelligent Everything」，總計有『四大主題演講』、『六大特別論壇』、『先進技術優秀論文』以及『二大企業論壇』等豐富內容。IMPACT 2017會係由IEEE CPMT-Taipei、IMAPS-Taiwan、工研院(ITRI)及台灣電路板協會(TPCA)共同主辦，同科技部材料工程學門和機械固力學門等專家聯盟參與。
 

IMPACT 2017 Conference, which is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. For grasping the latest trend, the IMPACT highlights the theme “IMPACT on Intelligent Everything” toward intelligent innovations, which fall into several areas: smart application, robot, drones, autonomous vehicles, artificial intelligence, and IoT devices. Moreover, IMPACT held in conjunction with TPCA SHOW 2017 at the same period. IMPACT also organized event like TPCA & IMPACT Joint Dinner Party and IMPACT Welcome Dinner in order to appreciate everyone to attend the conference. The valuable influence toward future trends that will shape the platform of high-tech industry and academic research had been built in this grand international conference.

企業贊助夥伴有台灣封裝雙雄日月光及南茂，而一般贊助有構裝大廠矽品；全球半導體大廠台積電；材料及化學廠有台燿、JSR、阿托科技、長興材料工業、麥德美、及陶氏化學；電鍍化鍍廠萬億等，皆共同參與支持此研討會，互相加乘。期間為感謝國內外講師及貴賓們的參與，也舉辦TPCA Show & IMPACT Joint Dinner Party 及IMPACT Welcome Dinner等活動。IMPACT儼然已成為台灣唯一橫跨上游材料、電路板、半導體、封裝測試領域的國際級研討會。
The conference collects numbers of papers from 18 different countries and record more than 200 speeches every year. This year, we received sponsor from ASE, ChipMO, JSR, TSMC, Atotech, Dow, Enternal, Trillian Corp., SPIL, MacDermid Enthone and TUC. We highly appreciate their support toward IMPACT 2017. For enterprises which are looking for enhancing company identity and technological strength, IMPACT welcomes for corporative sponsorship.